Major disadvantage of proximity and contact printing masks are contamination after several times exposures which results resolution degraded ad yield low. Anti-scratch or anti-finger coating not only resolve this issue but also improve printed resolution to 5um because of direct contact.
Another issue of direct printing is the electro-static charges built up after many times contact movement. This electrostatic charges could be prevented by AS/AF coating as well because mask Cr-film patterns are protected from direct bombardment.

AS/AF mask coating



ESD/AS mask coating
Applications:
Cr-mask usually suffers ESD(electro-static discharge) issue after long time friction between mask and exposed substrate. This ESD can be released by using conductive AS/AF coating offered by Cti unique technology.
Fluorinated SiOx ESD material materials was coated on mask using slit or spin coating that will successfully dissipate ESD to <800V and safe mask from Cr-pattern broken.
Specifications: ESD <800V after 100times attach and release from substrates.
■ Process: mask cleaning, then spin or slit coating Fluorinated resin on mask, finally oven baking to secure its reliability.  Defect control: >5um of particle and with AOI scanning capability of 5um.

Copy mask and Black matrix blank
Black Matrix blank and Mask
applications: this product can replace current emulsion mask blank and also low cost film emulsion.
comparisons between Emulsion an black matrix blanks
Specification: black Carbon film 1.5um, OD=3.8, similar as Cr-film blank.
Resolution can be 10um which is better or similar as Emulsion blank.
Advantages of black matrix blank: better uniformity, higher sensitivity, better adhesion, larger process window
Reliabilities: high thermal resistance, higher light endurance on light and chemicals, long shelf life.
Benefits other than quality
it is environmental friendly material far better than Emulsion having silver halide.
Silver halide emulsion material is out of date actually, blank matrix is a material used on LCD panel and can be patterned as lithographic process.

Applications:
mask using contact and proximity printing, with this overcoat film masks are greatly reduced particle contamination in hard and vacuum contact, which resulting mask lifetime increase..
PCB emulsion mask, where feature sizes are 10 to 40um, AS_mask will improve yield, because mask and substrate do not risk contact. However, where gaps are sometimes reduced to 30 microns in order to pattern 10um   features, AS_mask is expected to help maintain the high process yield of small gaps.
Process: mask cleaning, then spin or slit coating Fluorinated resin on mask, finally oven baking to secure its reliability.  Defect control: >5um of particle and with AOI scanning capability of 5um.