With 30um resist thickness capability, we can make mask patterns with various thickness resist which allows controlling the depth of electroplating mold. Minimum achievable CD is 5um and electroplating depth depends on the resist thickness.
According pattern CD and its aspect ratio requirements, mold can be classified into:
- Quartz glass mold: CD>2um, depth <0.3um and its Maximum size 800x960x8t
- Sodalime glass mold: CD>5um, depth <1.5um, and maximum size is 800x960x8t
- Electroplating mold: all depth beyond 1.5um can be achieved using this technology.